Go to GlobalSpec.com Home

Semiconductor Products -- Proforma™ AutoScan 200

Print Print

No Image
Provided

The AutoScan 200 and AutoScan 300 are fully
automated measurement systems for use in high
volume, production environments. Capable of
determining thickness, TTV, bow, warp, site and
global flatness and resistivity, the
AutoScan series utilizes user-defined
and ASTM/SEMI scan patterns to
generate full 3-dimensional
images of 75 to 300 mm
diameter wafers.

Specifications

Technology / Type Thickness Gage; Gaging System or Station; Wafer Thickness (Non-Contact), Flatness; Capacitance
Applications Material Thickness
Form / Mounting Automatic or Inline; Continuous Plant or Field Monitoring System
Performance Specifications
Range 0.0000 to 1.0000 mm
Accuracy  
Other Specifications / Features
Display Type  
Additional Features  


Part Saved

You've successfully added from to your part list.

Save part

Part Name / #:
Product Type:
Description:
Cancel