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Semiconductor Products -- Proforma™ 300SA
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The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Specifications
| Technology / Type | Thickness Gage; Gaging System or Station; Wafer Thickness (Non-Contact), Flatness; Capacitance |
| Applications | Material Thickness |
| Form / Mounting | Automatic or Inline; Bench, Rack or Floor Mounted; Handheld or Portable; Continuous Plant or Field Monitoring System |
| Performance Specifications | |
| Range | -0.5000 to 8.0000 mm |
| Other Specifications / Features | |
| Display Type | |
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