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Semiconductor Products -- Proforma™ 200SA
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The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.
Specifications
| Technology / Type | Thickness Gage; Gaging System or Station; Wafer Thickness (Non-Contact), Flatness; Capacitance |
| Applications | Material Thickness |
| Form / Mounting | Bench, Rack or Floor Mounted; Handheld or Portable |
| Performance Specifications | |
| Range | 0.0000 to 1.0000 mm |
| Accuracy | |
| Other Specifications / Features | |
| Display Type | |
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