Designed for accelerated life cycle testing of semiconductor and electronic devices. Product is moved from cold to hot zone chambers by a pneumatically operated elevator with adjustable transfer speeds. Single load or double load capacity allows tested devices to undergo the same temperature cycle conditions, cycle after cycle. Performs to MIL STD 883C and JESD22. (read more)

NX™ Thermal is an engineering analysis solution native to the NX Advanced Simulation environment that simulates thermal and heat transfer for complex products and processes within single parts or large NX assemblies of parts. It allows for high fidelity simulations of fully coupled radiative, conductive and convective heat transfer. (read more)

Apparent thermal conductivity is measured by plate steady state method according to ASTM E 1225. A test specimen is inserted under load between two similar specimens of a material of known thermal properties. A temperature gradient is established in the test stack and heat losses minimized using a longitudinal guard having approximately the same temperature gradient conditions. (read more)

These switches, are highly resistant to shock and vibration while maintaining exceptionally close repeatability. Since the entire probe is heat sensitive, it acts as an averaging device, thus compensating for temperature gradients. (0-1850F, fast response time) (read more)

Coto Technology's 3500 and 3600 series Low Thermal EMF Reed Relays reduce thermocoupling and provide for true voltage measurements at very low signal levels. The 3500 & 3600 series Reed Relays address the problem of stray voltages introducing errors into the signal path when measuring low level signals (tens to hundreds of microvolts). (read more)

The SBS-3660 Thermal Infra-Red Camera provides an affordable way to quickly obtain I-R thermal levels & compare them to real-life (RL) systems. The camera captures thermal gradients in 64 on-screen divisions & can display the results super-imposed upon the actual component; or you can toggle between RL, thermal grid or thermal box views. (read more)

The following electrical and thermal testing capabilities on dielectric materials have been added to our already extensive polymer testing scope: Capacitance, Dissipation Factor and Dielectric Constant Dielectric Strength Volume and Surface Resistivity Specific Heat Capacity Thermal Conductivity. (read more)

In most instances the product from a VIM is further processed under vacuum. One such application is vacuum precision investment casting for the production of advanced high quality cast components. Using the principles of the 'lost wax' process, a ceramic mold is prepared and heated prior to casting. (read more)

Thermal pads are superior in efficiency and last longer than thermal paste - a commonly used material for computer processors and other heat-sensitive components. (read more)

High Precision cutoffs designed to protect against over-heating. Available in Axial, Radial, and Surface Mount Styles. (read more)