The Panametrics-NDT™ Model 25 MULTI PLUS from Olympus NDT is an advanced ultrasonic precision thickness gage with several unique measurement capabilities. In addition to making thickness measurements on metal, plastic and many other materials with varying thickness ranges, the 25 MULTI PLUS has the ability to calculate and simultaneously display up to four separate measurements. (read more)

The Proforma 300 TM wafer thickness gage can be used to measure thickness, bow and TTV on all wafer materials including: silicon,gallium-arsenide,indium phosphide and germanium without recalibrating or electrically grounding the wafer. (read more)

Proforma 300/G - Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape. (read more)

Danatronics is proud to introduce the world's smallest ultrasonic thickness gage with high resolution waveform display, the EHC-09 with live Waveform (A-Scan) unique features include... (read more)

Danatronics is proud to introduce the UPG-07 series of hand-held ultrasonic thickness gages with un-precedented features and benefits. (read more)

Danatronics is proud to introduce the world's SMALLEST and ONLY ultrasonic thickness gage with high resolution COLOR waveform display, The EHC-09 Wave. Unique features include live COLOR A-Scan, Encoded B-Scan, 50K thickness reading (5000 waveforms) datalogger... (read more)

These small but rugged units provide fast and accurate measurements on internally corroded parts. They also packed the MG2 Series with a host of practical measurement features including Automatic Probe Recognition, High Temperature capabilities, and Min Max and Freeze Modes. All three models are tough enough to be used in even the most demanding applications. (read more)

New pocket sized electronic instrument with integrated measurement probe for coating thickness measurements over steel or iron according to the magnetic induction and eddy current methods. (read more)

All thread gages are supplied with a Certificate of Accuracy. (read more)

Rogue Valley Microdevices offers E-Beam Evaporation of metal stacks including but not limited to Ti, Cr, Ni, Ag, Au, and Pt. Our E-Beam Evaporation process provides excellent film thickness uniformity. Evaporation is done at low temperatures that will not damage photoresist for metal lift-off. Our process capabilities allow us to deposit up to six different materials in-situ. (read more)