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Welcome to GlobalSpec - a trusted source for engineers and industrial professionals.
Search GlobalSpec to find backplane test-related products, suppliers, datasheets and CAD.
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Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Backplane testers evaluate and record the integrity of printed circuit boards (PCBs) and passive component electronics such as resistors, capacitors, and diodes. Learn More
Backplanes are circuit boards that contain sockets or expansion slots for connections to other circuit boards. There two types of backplanes: active and passive. Search by Specification | Learn More
Automated test equipment (ATE) is used to monitor and control test and measurement devices, keeping human interaction at a minimum. Search by Specification | Learn More
EMC Testers are devices used to test or monitor parts and products for electromagnetic compatibility (EMC). Search by Specification | Learn More
Non-destructive testing (NDT) material testers are devices, machines and equipment that are used to determine residual stress, alloy type, hardness, microstructure, elasticity, heat treatment and other material conditions without permanently altering or destroying the material being examined. Search by Specification | Learn More
Mechanical testing equipment covers devices used for adhesion, compression, drop (shock), tensile, vibration and fatigue testing. Search by Specification | Learn More
Hardness testers measure a material's resistance to indentation. This calculation is determined by measuring the permanent depth or projected area of the indentation. Search by Specification | Learn More
Capacitance testers are used to test the capabilities and performance of capacitors. Search by Specification | Learn More
Continuity testers are electrical test instruments that are used to determine if an electrical circuit exists between two points. Search by Specification | Learn More
Fiber optic test equipment is used to detect the signal loss/change through a fiber optic cable. Search by Specification | Learn More
Environmental test chambers and rooms are used to ensure the reliability of industrial products, especially electronic items, through prolonged exposure to one or more environmental parameters. Search by Specification | Learn More
Pulp and paper testers include specialized sensors, instruments, COBB testers, and test equipment for evaluating the material properties and processability characteristics of pulp and paper. Search by Specification | Learn More
Ground bond testers are electrical safety test devices that perform electrical compliance tests. Search by Specification | Learn More
...of instruments and systems. Examples include thickness gauges, flaw detectors, material condition testers, and eddy current instruments, as well as devices that measure conductivity, resistivity and corrosion. Some non-destructive testing (NDT... Search by Specification | Learn More
Wire harness testers evaluate continuity, resistance, isolation, and other performance factors for multi-strand wire harnesses. Search by Specification | Learn More
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D30R D40R D85R Surge/HiPot Resistance Tester Baker Instrument Company, an SKF Group Company
Used Oscilloscopes Electro Rent Corporation
Portable 3.3 & 8.5 GHz Handheld Spectrum Analyzers B&K Precision
ILinx Industrial Serial Converters and Repeaters B&B Electronics Manufacturing Co. Inc.
Dash 8HF - High Frequency Data Recorder Astro-Med, Inc.
I/O Terminals Control DC Motors Beckhoff Automation LLC
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SIE Computing Solutions, Inc. is the industry leader in Backplane design, offering multiple standard and custom solutions based on the following technologies: VPX, VXS, VME64, CompactPCI, AdvancedTCA, MicroTCA and custom bus structures. (read more)
The 14-slot Dual Star complies with the latest MicroTCA.0 specifications. The connectors are compression mount, which can be easily removed from the backplane individually if damaged. Elma Bustronic is also developing MicroTCA backplane configurations in press fit and SMT styles. (read more)
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes now offers its CompactPCI backplanes in RoHS compliant styles. It has updated dozens of CompactPCI backplane designs to meet the compliance standard. The RoHS backplanes are compliant to the PICMG basic specification 2.0 R3.0 and PICMG Hot Swap specification 2.1 R1.0 (read more)
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has announced a 6-slot AdvancedTCA Backplane in a Mesh topology. The flexible design also allows a Dual Star topology to be implemented. (read more)
SIE Computing Solutions VPX backplanes are designed to the latest VITA 46 and 48 standards. The 5-slot I/O PLUS™ 3U VPX Full Mesh Backplane is designed for a wide array of VPX applications. (read more)
AP Labs range of high performance backplanes are compliant to the latest VMEbus specification and are suitable for multiple environments from the laboratory to deployment. (read more)
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has offers over 100 slot size variations of VME-based backplanes standard and off-the-shelf. These include a wide range of designs in 3U VME, 6U VME, 6U VME64x, 7U VME64x, VME320, VXS, VITA 31.1, and VPX (VITA 46). (read more)
SIE Computing Solutions, Inc. is the industry leader in Backplane design, offering multiple standard and custom solutions based on the following technologies: VPX, VXS, VME64, CompactPCI, AdvancedTCA, MicroTCA and custom bus structures. (read more)
SIE Computing Solutions, Inc. is the industry leader in Backplane design, offering multiple standard and custom solutions based on the following technologies: VPX, VXS, VME64, CompactPCI, AdvancedTCA, MicroTCA and custom bus structures. (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 487A300G | PLC Radwell | USON CORP | Not Provided | BACKPLANE FOR 4600 LEAK TESTER 486&386 PROCESSOR |
| M00487A300G | PLC Radwell | USON CORP | Not Provided | BACKPLANE FOR 4600 LEAK TESTER 486&386 PROCESSOR |
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XAPP537 - MultiBERT IP Toolkit for Serial Backplane Signal... Application Note: Virtex-II Pro R MultiBERT IP Toolkit for Serial Backplane Signal Integrity Validation Author: Delfin Rodillas XAPP537 (v1.1) See Xilinx, Inc. Information |
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Xilinx Virtex-II Pro FPGAs Enable XAUI De-Skew Validation At... XILINX VIRTEX-II PRO FPGAS ENABLE XAUI DE-SKEW VALIDATION AT UNIVERSITY OF NEW HAMPSHIRE 10Gb ETHERNET INTEROPERABILITY GROUP TEST See Xilinx, Inc. Information |
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National Semiconductor Introduces Industry’s First... National Semiconductor Introduces Industry?s First System Test Access Evaluation Kit for Multi-card Backplane Environments See National Semiconductor Information |
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Application Note 1340 Simplified Programming of Xilinx Devices... networking systems in- backplane, and manages up to 3 or 7 local scan chains corporate a system-wide IEEE 1149.1 (JTAG) test bus infra- See National Semiconductor Information |
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AN-1023 Structural System Test via IEEE Std. 1149.1 with... 1. If the exact system configuration is known at test time, However, there may be passive pull-up resistors to hold which is often the case in See Fairchild Semiconductor Corporation Information |
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Field Notice: *Expired* FN - 26254 - ONS 15530... - ONS 15530 Power-On-Diagnostics (POD) Fails Intermittently For Backplane Idprom Test When Running IOS 12.1(12c)EV2 |
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Backplane Testing, Cable Testing, Connector Testing, Cord... means you can count on us to solve your cable, backplane, connector, power cord or wire test challenges quickly, and back it with highly reliable See CableTest Systems, Inc. Information |
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InterOperability Laboratory Backplane Data Center Bridging DSL Ethernet Pay Per Test Ethernet Testing Ethernet Switching |
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Amphenol TCS - Backplane Assembly Services: Comprehensive... Comprehensive Test Solutions Multiple backplane test platforms and layered test approach See Amphenol TCS Information |
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DCMIM testing Object of the test: Test the functionality of the Data Collection Interface Module. |